In recent weeks, numerous reports have surfaced regarding certain iPhone 15 Pro models experiencing overheating issues. Users have been vocal about the heat-related concerns ever since the Pro series was launched.
Renowned analyst Ming-Chi Kuo has now offered insights into the matter, indicating that the root cause of the overheating woes may not be the fault of Apple’s A17 Pro chipset but rather compromises made in the design of the phone’s thermal system. Despite the A17 Pro being manufactured using TSMC’s cutting-edge 3nm node, known for its efficiency, it appears that it still generates more heat than the phone’s thermal system can effectively dissipate.
One of the key contributing factors to this dilemma is Apple’s pursuit of making the new iPhone Pro models lighter. It’s reported that in the quest to reduce weight, Apple had to decrease the heat dissipation area. Coupled with the high heat conductivity of titanium used in the phone’s construction, this has led to suboptimal heat management for the new chipset.
Apple is expected to address the overheating issues through a forthcoming software update. While such an update can help manage the problem to some extent, it may not entirely resolve it. The most effective way to prevent the phone from overheating via software would involve limiting its performance and consequently reducing power requirements, resulting in less heat generation.
However, Kuo’s theory does not fully explain why only a portion of iPhone 15 Pro units are affected by overheating. Some users, including reviewers, have not encountered this issue on their devices. Speculation suggests that variations in cooling pad materials might be a contributing factor. Further investigation is needed to ascertain the exact cause, and we will continue to monitor the situation and provide updates as new information emerges.