In a surprising turn of events, Huawei is set to unveil its new Kirin 830 chipset, despite earlier declarations that there would be no Kirin chipsets in 2023. The company had previously refuted reports claiming otherwise, but now, there are clear plans for another SoC release – the Kirin 830. This chipset is expected to make its debut alongside the nova 12 series, slated for the end of this year.
This unexpected development from Huawei highlights the company’s determination to navigate the challenging landscape of international restrictions and continue offering innovative technology to its users. The Kirin 830’s performance capabilities and the extent of its integration with 5G technologies will be closely monitored as it enters the market, with many eagerly anticipating the launch of the nova 12 series to see how this new chipset will impact Huawei’s smartphone lineup.
The Huawei Kirin 830 chipset, a name that’s been circulating in the rumor mill, is anticipated to power the standard nova 12 smartphone. Leaked posters have shed light on the nova 12, revealing a triple-camera setup on its rear and an impressive 60 MP front-facing camera for stunning selfies. Furthermore, the nova 12 is expected to support 88W fast charging.
While the precise performance metrics of the Kirin 830 remain speculative, it is rumored to compete with Qualcomm’s Snapdragon 778G and Snapdragon 870. However, a significant concern remains – the chipset’s manufacturing, as US companies currently hold the 5G technologies and patents, and they are prohibited from conducting business with Huawei and its subsidiary chipset manufacturer, HiSilicon.
Source (in Chinese)
