Title: MediaTek Dimensity 9300 Faces 46% Performance Drop in Stress Test, Vapor Chamber Struggles to Keep Temperatures in Check
In a recent CPU stress test, MediaTek’s Dimensity 9300, known for its departure from the traditional CPU cluster, experienced a significant performance dip. Unlike its Snapdragon 8 Gen 3 counterpart, the Dimensity 9300 lacks efficiency cores, leading to remarkable overall performance but at the cost of increased power consumption. The test was conducted on Vivo’s X100 Pro, equipped with a vapor chamber cooling solution designed to manage the chipset’s temperatures effectively.
Despite being manufactured on TSMC’s power-efficient N4P process, the absence of low-power cores in the Dimensity 9300 results in higher power draw compared to competitors like the Snapdragon 8 Gen 3 and A17 Pro. Sahil Karoul’s CPU Throttling Test demonstrated that, even with the capable cooling solution, the Dimensity 9300 succumbed to thermal throttling within two minutes. The test, which loads the chipset’s 8-core CPU with up to 100 threads, revealed a significant drop in performance, with one core clocking down to 0.60GHz and others reduced to 1.20GHz and 1.50GHz. The overall performance plummeted by 46% during the stress test.
While these results suggest that MediaTek’s decision to opt for a CPU cluster with performance-only cores may not be ideal, it’s crucial to consider environmental factors influencing thermal performance. In hot and humid conditions, such as those found in some regions, the Dimensity 9300 may experience faster thermal throttling. It’s worth noting that under normal usage conditions, the flagship SoC might perform adequately. However, the findings raise questions about MediaTek’s approach and potential adjustments for the upcoming Dimensity 9400.
Source: Sahil Karoul
